Introduction: In this example you will learn to model a cooling fin for electronics. This involves heat generation, conduction and convection.
Physical Problem: All electronic components generate heat during the course of their operation. To ensure optimal working of the component, the generated heat needs to be removed and thus the electronic component be cooled. This is done by attaching fins to the device which aid in rapid heat removal to the surroundings.
Problem Description:
This is the assembly of the entire fin… analyze only the section of the light blue
fins that does not include the base…
Front View
IMPORTANT: Convert all dimensions and forces into SI units.
Basic Outline of the Problem:
Preprocessing:
1. Start ANSYS.
2. Create areas.
3. Define the material properties.
4. Define element type. (Quad 8node 77 element, which is a 2-D element for heat transfer analysis.)
5. Specify meshing controls / Mesh the areas to create nodes and elements.
Solution:
6. Specify boundary conditions.
7. Solve.
Postprocessing:
8. List the results of the temperature distribution.
9. Plot the results of the temperature distribution.
Exit:
10. Exit the ANSYS program, saving all data.
STARTING ANSYS
Click on ANSYS 6.1in the programs menu.
Select Interactive.
The following menu that comes up. Enter the working directory. All your files will be stored in this directory. Also enter 64 for Total Workspace and 32 for Database.
Click on Run.
MODELING THE STRUCTURE
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